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Haohai Metal Meterials Co., Ltd.

Adress:

Plant No.19, TusPark, Century Avenue, 

Xianyang City, Shaanxi Pro., 712000, China


Tel:  

+86 29 3358 2330 

+86 29 3358 2349


Fax: 

+86 29 3315 9049


E-mail: 

info@pvdtarget.com

sales@pvdtarget.com



Service Hotline
029 3358 2330

Elastomer Bonding Service

Elastomer is an alternative bonding method that touts a higher temperature capability over the indium bond. Elastomer bonds are recommended when customers are consistently melting indium bonds. We also recommend elastomer bonding for low melting point target materials, as well as, temperature sensitive compounds and targets that have either low density or are especially fragile. Elastomer bonding is performed at relatively low temperatures between 50°C and 100°C so it is gentler on the target during the actual bonding process.

Product Details


Elastomer Target Bonding Service


Features

Elastomer is an alternative bonding method that touts a higher temperature capability over the indium bond. Elastomer bonds are recommended when customers are consistently melting indium bonds. We also recommend elastomer bonding for low melting point target materials, as well as, temperature sensitive compounds and targets that have either low density or are especially fragile. Elastomer bonding is performed at relatively low temperatures between 50°C and 100°C so it is gentler on the target during the actual bonding process. 


Many customers hesitate to choose the elastomer bond because they know that most polymer based materials will outgas in a vacuum chamber. The elastomer bond is actually UHV compatible and has a NASA "A" rating which means that it undergoes less than a 1% total mass change at 150°C at 1 x 10-7 Torr for 24 hours. In addition, the elastomer does not absorb any moisture and is more than suitable to handle cycles between vacuum and atmosphere.


Specifications Table

Maximum Operating Temperature (°C)250 ° C
Thermal Conductivity (W/mK)54
Coefficient of Thermal Expansion (K-1)2.2 x 10-4
Electrical Resistivity (ohm-cm)0.0476
Bond Coverage>98%
Bond Line Thickness0.010” – 0.025”


Benefits of Bonding Sputtering Targets

A material can transfer heat through its thickness faster when the material is thinner. For most sputtering R&D guns, the thickness of the target is reduced to half when it is bonded to a backing plate because the gun has a maximum thickness allowance. The copper backing plate comprises the other half of the thickness. The thinner target can cool more effectively than a thicker target because the distance that the heat generated on the surface of the target has to travel to reach the cooled side is reduced.


A ceramic material can cool more efficiently when bonded. The target is in intimate contact with the conductive solder layer which draws the heat from the target surface and into the copper backing plate. The copper backing plate is in contact with the water cooled gun so the heat is transferred through both pieces of copper and is removed through the cooling water.


Some ceramic sputtering targets will crack during sputtering due to thermal shock regardless of whether the target is bonded or the ramping procedure used to condition the target. Bonded targets can usually continue to be used even after a target crack occurs, where typically an un-bonded target cannot.



Haohai Metal Assurance for Bonding Service

To improve thermal conductivity under high power inputs, we offer target bonding on backing plates using indium-, elastomer-, aluminum- and silver-based metallic alloy. Durable target bonding requires a variety of pre and post bond functions to assure adhesion. Our quality bonding techniques and process are characterized as following:

1. To eliminate cavities at the edges of a solder bond that may entrap air and form a virtual vacuum leak in your sputtering system.

2. To ensure the thermal integrity of the interface between the system's cooling assembly and the surface of the target.

3. Zone controlled hot plates for precise control of thermal expansion and solderability.

4. C-Scan imaging system is used to detect material flaws, interrogate bonds and accurately measure thickness.

5. X-ray radiographic inspection to verify bond integrity.


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